Biocompatible, Nanosilica Filled LED Cure Adhesive
Master Bond LED405Med is a one component, LED curing adhesive system utilized for bonding, sealing, coating and encapsulating in medical device assemblies. It is in full compliance with the ISO 10993-5 cytotoxicity standard. The system is comprised of a nanosilica filled resin, which results in both a lower shrinkage upon cure, as well as greater dimensional stability.
LED405Med is a no-mix system that cures fully tack-free upon exposure to a 405 nm wavelength light source without any oxygen inhibition. Since it does not need a UV light for curing, it is intrinsically more user friendly. In thinner sections, full cures can be achieved in 30-45 seconds. The rate of cure depends upon the intensity of the light source, the thickness of the adhesive layer and the distance from the light to the adhesive.
The compound provides a coefficient of thermal expansion of 35-40 in/in x 10-6/°C. It cures to a hardness of 65-75
Shore D, indicating that it is not too stiff. This system is optically clear, with a refractive index of 1.50, and it provides excellent light transmission properties. It is electrically insulative with a high volume resistivity of more than 1014 ohm-cm and a low dielectric constant of 4.2 at 60 Hz. It has good flowability with a viscosity of 2,000-8,000 cps. LED405Med cures up to 0.125 inch thick and is suitable for small encapsulations involving optical assemblies or other sensitive components. Serviceable from -60°F to +250°F, it withstands gamma radiation as well as various chemical sterilants including EtO.
In this video, we demonstrate how to properly apply and cure an LED curable adhesive system using a portable LED light source, using LED405Med. See how easy it is to cure and learn more about its performance properties. Watch now.